Continuous Technological AdvancementThe company has adopted ongoing advancements in encapsulant technology to develop several improved encapsulant solutions to align with evolving cell technologies.HIUV’s latest co-extruded EPE Film, the top choice for module encapsulation in TOPCon, incorporates multiple technological innovations. These include optimized additive formulations that enhance the product’s anti-PID polarization performance, as well as a strengthened POE layer within the EPE structure to effectively prevent lamination bubbles. The company also noted that it is possible to achieve up to 100% lamination yield with no additional padding required at the edges during the mixed sealing process between EPE and EVA at the module lamination stage. These claims have been validated by multiple customer internal validation tests.Recently, HIUV introduced an innovative co-extruded EXP film – P507S – as a cost-effective alternative to pure POE film. This film features a lower gram weight by significantly reducing the amount of POE resin and includes a middle layer of X-structural strengthening sandwiched between the POE and EVA layers.To align with the preferences of TOPCon module makers for cost-effective, high-efficiency production, the company introduced a dual-glass, dual-EVA configuration, featuring modified EVA films in either transparent or white. This advanced EVA film series - S201MT / S201W - offers multiple advantages, such as a higher moisture barrier, ultra-low acid value, and strong anti-PID properties. The anti-PID functionality of the EVA film works by capturing adsorbed ions and blocking metal ion penetration through cation exchange or complexation, which reduces the impact of impurity ions on solar cell performance. Additionally, the low-acetic acid value of the EVA provides excellent anti-corrosion properties in hot and humid environments. Other performance-enhancing mechanisms in this advanced EVA include the addition of ion trappers, increased cation barrier properties, and reduced chemical and electrochemical corrosion of cells.
