HJT Cell ProcessingSingulus Technologies manufactures equipment for key HJT process steps, including HJT wafer surface texturing, core layer deposition, and TCO layer deposition. The company also provides the latest passivated edge technology (PET) tool for half-cut cell edge passivation.Wet Chemical ProcessingThe SILEX III series batch-type wet chemical treatment tool is designed for texturing and cleaning wafers up to G12 or G12 half-cut sizes, with the capacity to deliver up to 1 GW of annual production. Compatible with thinner wafers, this tool boasts a low breakage rate of just 0.1%, processing over 8,000 G12-sized textured wafers per hour. For G12 half-cut wafers, throughput can exceed 14,000 wafers per hour. The tool features an in-house ozone system for cleaning and etching, enhancing efficiency and reducing the cost of ownership (COO). Additionally, the integrated advanced process control system helps conserve primary texturing media, extending bath life and further reducing COO. According to the company’s datasheet, the tool can achieve etch removal of less than 22 µm per wafer, while the reflectivity of the textured wafer surface can be reduced to 11% or below.Core Layer Deposition ProcessSingulus Technologies also offers the GENERIS series PECVD tool, a horizontal inline high-throughput solution for core layer deposition in 2 types of HJT cell structures: (i) a-Si:H / (n) a-Si:H / (i) a-Si:H / (p) a-Si:H and (ii) a-Si:H / (n) nc-Si-H / (i) a-Si:H / (p) nc-Si:H. Equipped with a tray return system (TRT) and RF-based static plasma source, this tool uses a linear dynamic deposition mechanism to deposit thin films with the required thickness. In a double-ended system, the number of plasma sources is determined by the required film thickness and cycle time. According to Singulus, the inline PECVD tool, with one tray and a cycle time of less than 45 seconds per batch, can achieve a throughput of over 7,600 wafers per hour for G12 wafers and more than 14,000 wafers per hour for G12 half-cut wafers. With more than 90% system uptime and a breakage rate of less than 0.1%, this tool utilizes integrated gas-based NF3 solutions for cleaning process.
