AiThority 2024年09月10日
Mobilint Debut New AI Chips at Silicon Valley Summit
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Mobilint 是一家由 CEO Dongjoo Shin 领导的边缘 AI 芯片公司,将在即将举行的硅谷 AI 硬件和边缘 AI 峰会上展示其最新的人工智能芯片技术。Mobilint 将展示其用于设备端 AI 的高效率 SoC 'REGULUS' 和用于本地 AI 的高性能加速芯片 'ARIES' 的现场演示。

👨‍💻 Mobilint 是一家由 CEO Dongjoo Shin 领导的边缘 AI 芯片公司,将在即将举行的硅谷 AI 硬件和边缘 AI 峰会上展示其最新的人工智能芯片技术。 Mobilint 将展示其用于设备端 AI 的高效率 SoC 'REGULUS' 和用于本地 AI 的高性能加速芯片 'ARIES' 的现场演示。 该峰会是全球 IT 巨头(如微软、英伟达、谷歌、Meta 和 AMD)以及知名初创公司展示其在 AI 和机器学习方面的进展的年度盛会。今年的峰会将邀请世界知名的 AI 专家作为演讲嘉宾,包括 Landing AI 的 CEO Andrew Ng 和微软 Azure 的 CTO Mark Russinovich。

🚀 Mobilint 在此次峰会上获得了七个独家研讨会名额中的一个,与 AMD、英特尔、高通和 SambaNova 等行业领导者齐名。该公司计划介绍其两款 AI 芯片。值得注意的是,REGULUS 将在此次活动中首次亮相全球市场。Mobilint 的研讨会环节收到了热烈的反响,报名人数已满。 REGULUS 是一款独立的 AI SoC,旨在提供超过 10 TOPS 的 AI 计算性能,同时功耗低于 3W。它集成了高性能 CPU、编解码器和 ISP 组件,使其适用于机器人、无人机、家用电器、行车记录仪和 CCTV 系统等应用。

🤖 Mobilint 计划在研讨会期间向公众发布软件开发工具包 (SDK) 教程,并计划在今年晚些时候建立一个平台,允许开发人员在 Web 环境中测试产品。 Mobilint 表示,它将在本月晚些时候进行其首款产品 ARIES 的流片。ARIES 的量产计划于明年 1 月开始,目前已开放预订。 CEO Dongjoo Shin 表示:“我们的目标是在此次活动中透明地展示我们 AI 半导体的实际性能、多功能性和可用性,证明我们的技术竞争力。我们致力于基于信任和与客户的共同成长来挑战全球市场。”

Mobilint, an edge AI chip company led by CEO Dongjoo Shin, is set to make waves at the upcoming AI Hardware & Edge AI Summit 2024 in Silicon Valley. The three-day event, starting on September 10th, will showcase Mobilint’s latest innovations in AI chip technology. The company will demonstrate live demos of its high-efficiency SoC ‘REGULUS’ for on-device AI and high-performance acceleration chip ‘ARIES’ for on-premises AI.

The AI Hardware Summit is an annual event where global IT giants such as Microsoft, NVIDIA, Google, Meta, and AMD, along with prominent startups, gather to share their developments in AI and machine learning. This year’s summit features world-renowned AI experts as speakers, including Andrew Ng, CEO of Landing AI, and Mark Russinovich, CTO of Microsoft Azure.

Mobilint has secured one of only seven exclusive workshop sessions at the event, joining the ranks of industry leaders such as AMD, Intel, Qualcomm, and SambaNova. The company plans to introduce two of its AI chips. Notably, REGULUS will be unveiled for the first time in the global market at this event. The Mobilint workshop session is receiving an enthusiastic response, to the point that reservations have already closed.

Also Read: AiThority Interview with Paul Fipps, President, Global Industries and Strategic Growth at ServiceNow

REGULUS is a standalone AI SoC designed to deliver AI computing performance of over 10 TOPS while consuming less than 3W of power. It integrates high-performance CPU, codec, and ISP components, making it suitable for applications in robotics, drones, home appliances, dash cameras, and CCTV systems.

Additionally, Mobilint plans to debut a Software Development Kit (SDK) tutorial to the public during the workshop and aims to establish a platform later this year that allows developers to test products in a web environment.

Mobilint shared that it will conduct the tape-out for its first product, ARIES, later this month. The mass production of ARIES is targeted for January next year, and pre-orders are currently open.

CEO Dongjoo Shin said, “We aim to transparently showcase the actual performance, versatility, and usability of our AI semiconductors at this event, proving our technological competitiveness. We are committed to challenging the global market based on trust and mutual growth with our customers.”

SOURCE Mobilint, Inc.

Also Read: Unilever and Accenture Join Forces to Establish a New Industry Standard in Generative AI-Powered Productivity

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The post Mobilint Debut New AI Chips at Silicon Valley Summit appeared first on AiThority.

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Mobilint AI 芯片 边缘 AI REGULUS ARIES
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