The US is betting big on the future of semiconductor technology, launching a $1.6 billion competition to revolutionise chip packaging and challenge Asia’s longstanding dominance in the field. On July 9, 2024, the US Department of Commerce unveiled its ambitious plan to turbocharge domestic advanced packaging capabilities, a critical yet often overlooked aspect of semiconductor manufacturing.
This move, part of the Biden-Harris Administration’s CHIPS for America program, comes as the US seeks to revitalise its semiconductor industry and reduce dependence on foreign suppliers. Advanced packaging, a crucial step in semiconductor production, has long been dominated by Asian countries like Taiwan and South Korea. By investing heavily in this area, the US aims to reshape the global semiconductor landscape and position itself at the forefront of next-generation chip technology, marking a significant shift in the industry’s balance of power.
US Secretary of Commerce Gina Raimondo emphasised the importance of this move, stating, “President Biden was clear that we need to build a vibrant domestic semiconductor ecosystem here in the US, and advanced packaging is a huge part of that. Thanks to the Biden-Harris Administration’s commitment to investing in America, the US will have multiple advanced packaging options across the country and push the envelope in new packaging technologies.”
The competition will focus on five key R&D areas: equipment and process integration, power delivery and thermal management, connector technology, chiplets ecosystem, and co-design/electronic design automation. The Department of Commerce anticipates making several awards of approximately $150 million each in federal funding per research area, leveraging additional investments from industry and academia.
This strategic investment comes at a crucial time, as emerging AI applications are pushing the boundaries of current technologies. Advanced packaging allows for improvements in system performance, reduced physical footprint, lower power consumption, and decreased costs – all critical factors in maintaining technological leadership.
The Biden-Harris Administration’s push to revitalise American semiconductor manufacturing comes as the global chip shortage has highlighted the risks of overreliance on foreign suppliers. Asia, particularly Taiwan, currently dominates the advanced packaging market. According to a 2021 report by the Semiconductor Industry Association, the US accounts for only 3% of global packaging, testing, and assembly capacity, while Taiwan holds a 54% share, followed by China at 16%.
Under Secretary of Commerce for Standards and Technology and National Institute of Standards and Technology (NIST) Director Laurie E. Locascio outlined an ambitious vision for the program: “Within a decade, through R&D funded by CHIPS for America, we will create a domestic packaging industry where advanced node chips manufactured in the US and abroad can be packaged within the States and where innovative designs and architectures are enabled through leading-edge packaging capabilities.”
The announcement builds on previous efforts by the CHIPS for America program. In February 2024, the program released its first funding opportunity for the National Advanced Packaging Manufacturing Program (NAPMP), focusing on advanced packaging substrates and substrate materials. That initiative garnered significant interest, with over 100 concept papers submitted from 28 states. On May 22, 2024, eight teams were selected to submit complete applications for funding of up to $100 million each over five years.
According to Laurie, the goal is to create multiple high-volume packaging facilities by the decade’s end and reduce reliance on Asian supply lines that pose a security risk that the US “just can’t accept.” In short, the government is prioritising ensuring America’s leadership in all elements of semiconductor manufacturing, “of which advanced packaging is one of the most exciting and critical areas,” White House spokeswoman Robyn Patterson said.
The latest competition is expected to attract significant interest from the US semiconductor ecosystem and shift that balance. It promises substantial federal funding and the opportunity to shape the future of American chip manufacturing. As the global demand for advanced semiconductors continues to grow, driven by AI, 5G, and other emerging technologies, the stakes for technological leadership have never been higher.
As the US embarks on this ambitious endeavour, the world will see if this $1.6 billion bet can challenge Asia’s stronghold on advanced chip packaging and restore America’s position at the forefront of semiconductor innovation.
(Photo by Braden Collum)
See also: Global semiconductor shortage: How the US plans to close the talent gap
Want to learn more about AI and big data from industry leaders? Check out AI & Big Data Expo taking place in Amsterdam, California, and London. The comprehensive event is co-located with other leading events including Intelligent Automation Conference, BlockX, Digital Transformation Week, and Cyber Security & Cloud Expo.
Explore other upcoming enterprise technology events and webinars powered by TechForge here.
The post US launches $1.6B bid to outpace Asia in packaging tech appeared first on AI News.
