中国芯片制造商龙芯中科于6月26日发布了3C6000系列服务器CPU，标志着中国在半导体自主研发方面取得重大进展。该芯片基于龙芯自主研发的LoongArch指令集，旨在摆脱对外国许可证和供应链的依赖，其性能可与英特尔第三代至强处理器相媲美。3C6000系列支持多达128个核心和256个线程，并已完成流片。龙芯还推出了针对工业和移动领域的2K3000和3B6000M芯片。龙芯强调“三重自主”战略，即拥有自主指令集、IP内核和生产流程，旨在构建独立于x86和Arm的生态系统。

🚀 Loongson 3C6000系列服务器CPU的发布，是龙芯在芯片自主化道路上的重要里程碑。该系列芯片基于LoongArch指令集，旨在减少对外国技术的依赖，并与英特尔的第三代至强处理器在性能上竞争。

💡 3C6000系列芯片的特点包括：支持多达128个核心和256个线程，性能可与2023年全球主流服务器CPU相媲美。超过40家国内制造商已推出基于该系列芯片的系统和解决方案，应用范围涵盖通用计算、人工智能计算、存储和工业控制等领域。

🔑 龙芯强调“三重自主”战略，即拥有自主指令集、IP内核和生产流程。龙芯董事长胡伟武强调，解决中国信息技术瓶颈的根本在于构建独立于x86和Arm的生态系统。同时，龙芯也在开发新一代GPGPU芯片9A3000，其性能可能比第一代LG100高出3-5倍。

💰 尽管研发投入导致亏损，但龙芯持续投入创新和市场拓展。此次发布会吸引了48家企业，包括浪潮、中兴、联想开天和软通动力等，它们都发布了基于3C6000系列的新产品。这些产品强调100%国产核心部件，并重点面向关键基础设施领域。

🌍 中国正在努力构建一个完全独立且具有全球竞争力的技术生态系统，龙芯的目标是重塑中国的数字基础设施。海淀区官员表示，当地集成电路企业在2025年前五个月的收入同比增长了20%，龙芯被视为本土创新的典范。

AsianFin -- Chinese chipmaker Loongson Technology launched its 3C6000 series server CPUs in Beijing on June 26, marking a major leap in the country’s push for self-reliance in semiconductors.

Built on the company’s proprietary LoongArch instruction set, the chips eliminate reliance on foreign licenses and supply chains and are positioned as performance rivals to Intel's third-generation Xeon processors.

The 3C6000 series, supporting up to 128 cores and 256 threads, completed tape-out earlier this year. The flagship 3C6000/Q reportedly outperforms Intel’s 40-core Xeon Platinum 8380, while other variants match the performance of 16- and 32-core Xeon chips from 2021. Loongson claims the overall performance of the series is competitive with mainstream server CPUs released globally in 2023.

More than 40 domestic manufacturers have rolled out systems and solutions based on the 3C6000 lineup, which targets applications ranging from general-purpose and AI computing to storage and industrial control. The company also introduced the 2K3000 and 3B6000M chips for industrial and mobile scenarios.

Loongson Chairman Hu Weiwu emphasized the company’s "threefold independence" strategy: owning the instruction set, IP cores, and production processes. "The fundamental solution to China’s information technology bottlenecks is to build a third independent ecosystem, outside of x86 and Arm," he said. Loongson's new fifth-generation LA864 microarchitecture, built on a 10nm-class process, delivers performance comparable to a 7nm x86 core.

The launch also marks progress in Chiplet interconnects, with the firm’s proprietary LoongLink technology pitched as a rival to NVIDIA's NVLink and Samsung's CXL.

In parallel, Loongson is developing a next-generation GPGPU chip, 9A3000, with performance potentially 3–5 times higher than its first-gen **LG100**, which is already in mass production.

Despite ongoing R&D losses—net losses reached 151 million yuan in Q1 2025 even as revenue grew 4.13% to 125 million yuan—Loongson is doubling down on innovation and market expansion.

The launch event brought together 48 firms including Inspur, ZTE, Lenovo Kaitian, and iSoft, all of which announced new products using the 3C6000 series. Many of these emphasize 100% domestically produced core components and target critical infrastructure sectors.

Shi Huikang, deputy director at the Ministry of Industry and Information Technology, said LoongArch represents a strategic breakthrough: "Key core technologies can’t be bought or begged for. They must be developed through self-reliance."

Loongson, which listed on Shanghai’s STAR Market in 2022, aims to reshape China’s digital infrastructure. Haidian district officials reported that local integrated circuit firms saw 20% revenue growth year-on-year in the first five months of 2025, citing Loongson as a model for indigenous innovation.

"China’s chip industry must move beyond survival," said Hu. "We are on the hard road to build a fully independent and globally competitive tech ecosystem. The payoff will be enormous."

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