The 2024/25 TaiyangNews Backsheets and Encapsulation Market Survey, the 4th edition in the series, highlights insights from key industry players in the segment. HIUV, a leading company in the encapsulation segment, has provided data for 3 models, each with specific applications. The company actually differentiates applications at the product level based on the layer they are applied to in the module wrap, and the products have undergone a few changes. S201MT1 is specially designed for the glass side of the laminate. It is now offered in a standard thickness of 420 μm instead of 450 μm, and is wider at 1,096 mm. As with all other EVA suppliers, HIUV offers a wide range of dimensions suitable for any special requirements. The density is given as 0.96 g/m3.
S201MT2 is promoted for rear-side encapsulation. Similar to the other models, it also comes with a surface finish of double-frosted and pyramid embossing to enhance the light trapping. In terms of mechanical properties, the specs for this model and the S201MT1 described above are the same. Both have a tensile strength of ≥ 18 MPa and ≥ 500% elongation in both MD and TD directions, while shrinkages are ≤ 2% and ≤ 4% in the respective directions. The bonding to glass is ≥ 60 N/cm, which is only relevant for glass-glass modules, and a backsheet adhesion strength of ≥ 50 N/cm. They are also identical in terms of performance attributes – limiting water vapor absorption to less than 0.1% in weight, a volume resistivity of ≥ 1x1015 Ohm.cm, and a refractive index of 1.48. As with the front EVA S201MT1, this rear encapsulant is also transparent, and both are rated with a light transmittance of 91% in a wavelength band of 380 to 1,100 nm. However, this EVA, placed at the rear of the laminate, is designed to protect UV exposure below 360 nm. These 2 complementary products exhibit ‘good PID suppressing properties’ according to HIUV (see Encapsulation Sector Balancing Innovation And Cost Pressures In Solar).
