taiyangnews 02月24日
Hangzhou First: Comprehensive Encapsulation Solutions For BC Modules
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本文深入探讨了BC电池封装的优化方案,针对HPBC、TBC和HBC三种BC电池技术的独特需求,提出了定制化的前后封装组合。重点介绍了杭州 फर्स्ट针对不同BC技术推荐的POE或EPE基前封装材料,以及用于HPBC和TBC背面封装的EVA、POE或EPE材料。此外,还详细介绍了杭州 फर्स्ट的高反射黑色薄膜FW806WH系列,以及用于满足正负极栅线之间绝缘要求的绝缘油墨,并介绍了用于美化组件外观的覆盖条或PI条。这些材料和技术方案旨在解决BC电池封装中的PID问题、腐蚀风险以及对UVID和水汽渗透的防护需求,从而提高组件的性能和可靠性。

🛡️ 针对HPBC和TBC组件,推荐使用小于360 GSM的POE或EPE基前封装材料,HPBC背面使用EVA,TBC背面使用POE或EPE,以解决PID问题和腐蚀风险。

🔆 杭州 फर्स्ट推出了高反射黑色薄膜FW806WH系列,该薄膜具有高达75%的反射率,允许红外波长通过,增强组件的美观性并提高功率输出,同时具备高颜色稳定性和迁移稳定性。

🧪 针对BC电池,开发了新型绝缘油墨,分为热固化和UV固化两种,有色或透明两种格式,适用于玻璃-玻璃和玻璃-背板配置,具有良好的附着力和低黄度指数等可靠性。

🎨 为了进一步提升BC组件的美观性,杭州 फर्स्ट还提供了覆盖条或PI条,用于覆盖电池矩阵之间的导线;同时,还提供高反射(HR)黑色背板,红外光反射率超过60%。

Comprehensive solutionsAfter explaining the unique requirements of BC cell encapsulations, Jin proposed an optimized combination of front and rear encapsulations tailored to the specific characteristics of BC cell technology. The HPBC cell technology module, whether in a glass-glass or glass-backsheet configuration, faces PID issues on the front side and a high risk of corrosion on the back due to metal contacts on both polarities. The TBC cell technology (the BC version of TOPCon) glass-glass module is also susceptible to PID degradation on both sides and carries a risk of corrosion on the backside. Additionally, the HBC cell technology (the BC version of HJT) module, in a glass-glass configuration, requires high resilience against front-side UVID and rear-side water ingress to the TCO layers.Aligning with the specific encapsulation needs of different BC technologies, Jin recommended POE or EPE-based front-side encapsulation of less than 360 GSM for both HPBC and TBC modules, with EVA for the back-side of HPBC modules. However, for the back-side of TBC modules, POE or EPE should be used. For the HBC technology module, Jin suggested thin front-side EVA or POE or EPE-based encapsulants, with a GSM value of less than 360, and POE or EPE-based encapsulants for the back-side.For the front-side thin encapsulation films, HANGZHOU FIRST offers both POE and EPE encapsulants. The company began in 2012 with the launch of the TF series cross-linked POE and has since made periodic technological upgrades. In 2019, they developed the first co-extruded EPE film, followed by the TF4N series POE film and 360 GSM POE film for BC cells in 2022, noted Jin. This thin POE film, with high light transmittance, possesses key characteristics required for BC modules, including a thickness range of 280 µm to 360 µm, anti-PID properties, low shrinkage rate, good adhesion to glass, and no visual defects. However, the thin front-side EPE film, with a GSM value of between 280 and 360, can be customized with an EPE layer ranging from 90 to 150 GSM. Additionally, the EP304 series meets key property requirements, including excellent PID resistance, cross-linking, and adhesion performance, as well as process requirements such as uniformity, flatness, and low shrinkage rate, explained Jin. Internal test data, under extended PID stress test of up to 288 hours for a glass-glass TOPCon module, featuring front-side EP304 EPE and rear-side EVA, shows anti-PID requirement can be met with a 110 GSM POE layer. According to Jin, the anti-PID requirements of TBC cells are similar to those of TOPCon cells, suggesting that EP304 can also meet the anti-PID needs of TBC cells.Furthermore, the company has launched the FW806WH series of high-reflective black films, featuring 2 layers: a black layer (cell side) and a white layer (airside). With a reflectance of up to 75%, this film allows infrared wavelengths between 760 nm and 1,100 nm to pass through the black layer and be reflected to the cell or front glass from the white layer. This unique feature enhances the module’s aesthetic appeal and boosts power output, said Jin. The film also offers high color stability and migration stability.The insulating ink, a new material developed for BC cells, meets the insulation requirements between the positive and negative gridlines during the interconnection process. It is available in 2 main categories: thermal curing and UV curing, as well as either in colored or transparent formats, suitable for glass-glass and glass-backsheet configurations, added Jin. Additionally, the FT (thermal curing) and FURN (UV curing) series insulating inks, with visible light transmittance of up to 86.4% and 84.4%, respectively, demonstrated excellent reliability properties, such as good adhesion and a low yellowness index under in-house extended stress tests, noted Jin.The company also offers cover strips or PI strips for BC modules, designed to cover the wires between the cell matrices, further enhancing the module's aesthetic appeal. On the backsheet side, the company provides high-reflection (HR) black backsheets with an infrared light reflection rate of over 60%, says Jin.

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BC电池 封装材料 光伏组件 高反射薄膜 绝缘油墨
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