R&D Progress StatusTongwei Solar, with an R&D investment of $568.9 million – equivalent to 2.86% of its 2023 revenue – has established a global innovation and R&D center in Chengdu, China. The center spans an area of 270,000 m², with 108,000 m² dedicated to R&D workshops. This integrated facility houses a TNC cell pilot line, TBC cell and module pilot lines, a module R&D center, and an HJT + GW-level perovskite cell lab. The company’s R&D portfolio covers a wide range of technologies, including PERC, TOPCon, HJT, XBC, and perovskite/tandem cell technologies.After providing an overview of the company’s R&D activities, Jiang presented the latest innovations in n-type cell technology platforms. These platforms combine p-PERC cells and TNC cell structures into a back-contact configuration, resulting in the p-TBC cell. The p-TBC cell features a 730 mV Voc, up to 25% efficiency, and bifaciality of up to 60%. By shifting both the front and back contacts to the rear side of the TNC cell structure, the company developed an n-TBC cell, which delivers a Voc of up to 743 mV, an efficiency of up to 26.5%, and bifaciality of up to 70%. A comparative analysis of p-TBC and n-TBC technologies revealed that cheaper p-type wafers are more prone to degradation compared to traditional n-type BC technology. Additionally, p-TBC cells exhibit lower minority carrier lifetime, which leads to reduced efficiency and a lower bifacial factor. Meanwhile, the company’s n-HTBC cell structure – a combination of n-TOPCon and n-HJT cell technologies – has achieved up to 27% efficiency and up to 75% bifaciality.Starting with the TBC pilot line in Q2 2022, the company’s latest BC technology report shows that as of December 2023, p-IBC or p-TBC technology achieved up to 25.51% efficiency, while n-IBC cell technology reached up to 26.66% efficiency by August 2024. Following the progress in BC technology, the company introduced the TNC cell technology roadmap. This includes upgrading the TBC 1.0 version, which achieves up to 25.4% mass production efficiency, to the TBC 2.0 version, with the potential to reach up to 26.5% efficiency at mass scale by incorporating multiple technological advancements. Key pathways for further progress include the integration of EPT, 0BB technology, advanced printing technology with improved metallization paste, and high-quality wafers.