TOPCon技术已超越PERC成为主流太阳能电池技术，其中激光增强接触优化（LECO）工艺是关键。LECO使接触解耦，实现无铝浆料、零主栅（0BB）方法和更低烧结温度。弗劳恩霍夫ISE正研究铜电镀接触替代银浆，初步M10 TOPCon电池电镀铜效率与丝网印刷相当，但银用量减少93%。此外，钝化边缘技术（PET）有助于减少半片电池边缘损失。TOPCoRE技术以p型晶圆取代n型，效率可达26%。未来，TOPCon电池有望成为多结串联结构中的底层电池。

✨激光增强接触优化（LECO）工艺是TOPCon技术成功的关键，它使接触解耦，并支持无铝浆料和零主栅（0BB）设计，降低了生产成本，提高了电池效率。

🔬弗劳恩霍夫ISE正探索铜电镀技术替代银浆，初步实验表明，铜电镀TOPCon电池在效率不降低的情况下，可减少93%的银用量，未来有望完全取代银的使用。

🛡️钝化边缘技术（PET）用于减少半片电池的边缘损失，尤其适用于高周长电池面积比例的情况，尽管一些制造商已开发出类似技术。

💡TOPCoRE技术通过使用p型晶圆替代n型，并省略前导电层，可将效率提升至26%，主要优点是消除了当前TOPCon技术中前表面的固有复合限制。

🔮未来，TOPCon电池有望成为多结串联结构中的底层电池，这表明TOPCon技术在未来光伏发展中具有广阔的应用前景。

Since then, TOPCon technology has come a long way to overtake PERC as the leading solar cell technology in industrial use. One of the major contributing factors among several others in its journey is the Laser-Enhanced Contact Optimization (LECO) process.  A game-changing innovation, LECO has been instrumental in increasing TOPCon cell efficiency as it decoupled the contact, and also enabled the use of aluminum-free pastes, zero busbar (0BB) approach, much lower firing temperatures, and very different boron diffusion parameters, said Wolf. Developed by a Germany based start-up, Cell Engineering, the company was fully acquired by Q Cells in 2023, and LECO is now being licensed to other TOPCon cell/module manufacturers. At Fraunhofer ISE, the effort now is on copper plating contacts to replace silver paste consumption that accounts for a large part of the production costs. Fraunhofer ISE has started with a pilot fabrication of M10 TOPCon solar cells with electroplating using copper. The initial batch demonstrated similar efficiencies as screen printing at 24% each, but with 93% lower silver usage, he shared. Wolf is confident that plating cells will be able to be processed without silver consumption in the future - by using Sn as the capping layer for copper instead of silver.Passivated Edge Technology (PET), developed at Fraunhofer ISE, helps recover losses by passivating the edges of shingled or half-cut cells. He said it is especially valuable for high perimeter cell area fractions. However, several manufacturers have developed their own methods to achieve these results.Wolf also talked about TOPCon Rear Emitter (TOPCoRE) technology which replaces n-type by p-type wafers, with no front conductive layer and the efficiency can go up to 26%, as against 25.8% in TOPCon. Its major benefit is that it omits inherent recombination of the front surface which is a limitation for the current TOPCon technology. However, the challenge is related to the alignment of the structures which can be met by industrial production conditions.In the future, Wolf sees TOPCon cells as forming a good choice for the bottom cell in a tandem structure in a multi-junction configuration.